1. Adhesives technology for electronic applications :
Author: James J. Licari and Dale W. Swanson.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesives.,Electronic packaging.,Electronics-- Materials.
2. Adhesives technology for electronic applications :
Author: by James J. Licari and Dale W. Swanson
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesives,Electronic packaging,Electronics-- Materials
Classification :
TK7871
.
L53
2005
3. Adhesives technology for electronic applications
Author: by James J. Licari and Dale W. Swanson
Library: Library of Institute For Color Science and Technology (Tehran)
Subject: Electronics- Materials,Adhesives,Electronic packaging
4. Advanced Flip Chip Packaging
Author: \ Ho-Ming Tong, Yi-Shao Lai, C.P. Wong Editors
Library: Library of Foreign Languages and Islamic Sources (Qom)
Subject: Electronic packaging,نصب تجهیزات الکترونیکی,a02,a02,Flip chip technology.
Classification :
E-Book
,
5. Advanced adhesives in electronics :
Author: edited by M.O. Alam and C. Bailey.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesive joints.,Adhesives-- Electric properties.,Adhesives.,Electronic packaging-- Materials.,Electronics-- Materials.
Classification :
TK7871
.
A38
2011
6. Advanced flip chip packaging
Author: Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, editors
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging,Flip chip technology
Classification :
TK7870
.
15
.
A38
2013
7. Advanced materials for thermal management of electronic packaging
Author:
Library: Central Library and Documents Center of Mazandaran University (Mazandaran)
Subject: Electronic apparatus and appliances ; Temperature control. ; Electronic packaging ; Materials. ;
8. Advanced materials for thermal management of electronic packaging
Author: Xingcun Colin Tong
Library: Central Library and Information Center of Shahed University (Tehran)
Subject: Electronic apparatus and appliances, Temperature control,Electronic packaging, Materials
Classification :
TK
،
7870
.
15
،.
T56
،
2011
9. Advanced materials for thermal management of electronic packaging
Author: / Xingcun Colin Tong
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Electronic apparatus and appliances, Temperature control,Electronic packaging, Materials
Classification :
E-BOOK
10. Advanced materials for thermal management of electronic packaging
Author: / Xingcun Colin Tong
Library: Central Library and Document Center of Shahid Chamran University (Khuzestan)
Subject: Electronic packaging.
Classification :
TK
,
7870
.
15
,.
T66
,
2011
11. Advanced organics for electronic substrates and packages
Author: research manager, Andrew E. Fletcher.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging -- Materials.,TECHNOLOGY & ENGINEERING -- Mechanical.
Classification :
TK7870
.
15
R474
9999
12. Advanced wirebond interconnection technolog
Author: / by Shankara K. Prasad
Library: Central Library and Document Center of Shahid Chamran University (Khuzestan)
Subject: Wire bonding (Electronic packaging)--Production control,Electronic packaging--Reliability
Classification :
TK
,
7836
,.
P715
,
2004eb
13. Advanced wirebond interconnection technology
Author:
Library: Central Library and Documents Center of Mazandaran University (Mazandaran)
Subject: Wire bonding (Electronic packaging) ; Production control ; Electronic packaging ; Reliability ;
14. Advances in electronic circuit packaging; proceedings
Author: Edited by Lawrence L. Rosine
Library: Library of College of Science University of Tehran (Tehran)
Subject: Congresses ، Electronic packaging
Classification :
TK
7870
.
I574
1962
15. Advances in electronic circuit packaging; proceedings
Author: Edited by Lawrence L. Rosine
Library: Library of College of Science University of Tehran (Tehran)
Subject: Congresses ، Electronic packaging
Classification :
TK
7870
.
I574
1964
16. Advances in electronic circuit packaging; proceedings
Author: Edited by Gerald A. Walker
Library: Library of College of Science University of Tehran (Tehran)
Subject: Congresses ، Electronic packaging
Classification :
TK
7870
.
I574
1960
17. Advances in electronic circuit packaging : proceedings of the fifth International Electronic Circuit Packaging Symposium, held at Boulder, Colorado, August 19-21, 1964
Author: Edited by Lawrence L. Rosine
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging Congresses
Classification :
TK
7870
.
I57
1960
18. Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack 95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Luhaina, Maui, Hawaii
Author: Sponsored by the Electrical and Electronic packaging Division, ASME, The Japan Society of Mechanical Engineers; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Congresses
Classification :
TK
7870
.
15
.
I57
1995
19. Air cooling technology for electronic equipment
Author: / edited by Sung Jin Kim and Sang Woo Lee
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Electronic apparatus and appliances- Cooling,Electronic packaging- Cooling,Heat- Convection,Air flow
Classification :
TK7870
.
25
.
A43
1996
20. Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
Author: sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Materials - Congresses , Materials - Electric properties - Congresses
Classification :
TK
7870
.
15
.
A85
1995
